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通过与二氧化硅纳米颗粒进行干磨提高双硫仑的溶出度。

Increased dissolution of disulfiram by dry milling with silica nanoparticles.

作者信息

Jing Guanghui, Zhong Yue, Zhang Ling, Gou Jingxin, Ji Xinchao, Huang Hao, Zhang Yu, Wang Yanjiao, He Haibing, Tang Xing

机构信息

Department of Pharmaceutics and.

出版信息

Drug Dev Ind Pharm. 2015;41(8):1328-37. doi: 10.3109/03639045.2014.949266. Epub 2014 Aug 18.

Abstract

The purpose of this study was to find a suitable method to increase the dissolution of disulfiram (DSF) which is easily decomposed. The dissolution of DSF within 1 h was significantly increased from 37% to >90% by co-milling with Aerosil® 200 pharm (Aerosil) and the increased dissolution remained stable during long-term storage while there was no significant degradation of DSF. By monitoring the changes in particle size of the grinding mixture, a mosaic DSF-in-Aerosil structure was demonstrated. The core size of the mosaic DSF/Aerosil system was 3.625 µm. The particle size of DSF was reduced from 20.75 µm to ∼200 nm and the size of the mosaic DSF/Aerosil system (3.625∼7.956 µm) increased on increasing the drug-loading content. Differential scanning calorimetry and X-ray powder diffraction analysis confirmed the largely amorphous state of DSF in the mosaic drug/carrier system. Fourier transform infrared spectroscopy confirmed the presence of hydrogen bonding between DSF and Aerosil. Scanning electron microscopy and transmission electron microscopy verified the DSF-in-Aerosil relationship in the particle size determination at different size levels. The possible mechanisms of dry milling included the hypothesis that during impact and collision, DSF particles melted into the surface of Aerosil turning them into an amorphous state or they became inlayed into the interspaces of the Aerosil structure with a much smaller size.

摘要

本研究的目的是找到一种合适的方法来提高易分解的双硫仑(DSF)的溶出度。通过与Aerosil® 200 pharm(气相二氧化硅)共研磨,DSF在1小时内的溶出度从37%显著提高到>90%,并且在长期储存期间溶出度的增加保持稳定,而DSF没有明显降解。通过监测研磨混合物的粒径变化,证实了DSF镶嵌于气相二氧化硅中的结构。镶嵌式DSF/气相二氧化硅系统的核心尺寸为3.625 µm。随着载药量的增加,DSF的粒径从20.75 µm减小到约200 nm,镶嵌式DSF/气相二氧化硅系统的尺寸(3.625~7.956 µm)增大。差示扫描量热法和X射线粉末衍射分析证实了镶嵌式药物/载体系统中DSF主要为无定形状态。傅里叶变换红外光谱证实了DSF与气相二氧化硅之间存在氢键。扫描电子显微镜和透射电子显微镜在不同尺寸水平的粒径测定中验证了DSF镶嵌于气相二氧化硅中的关系。干磨的可能机制包括这样的假设:在冲击和碰撞过程中,DSF颗粒熔化到气相二氧化硅表面使其变为无定形状态,或者它们嵌入到尺寸小得多的气相二氧化硅结构的间隙中。

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