Li Yi, Moon Kyoung-sik, Wong C P
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA.
Science. 2005 Jun 3;308(5727):1419-20. doi: 10.1126/science.1110168.
In conventional consumer electronics such as cell phones, lead-containing interconnects provide the conductive path between different circuit elements. Environmental concerns have led to a search for lead-free alternatives. In their Perspective, Li et al. review these efforts, which have focused on lead-free alloys and electrically conductive adhesives. Both of these approaches are showing promise, but no one lead-free interconnect material can serve as a substitute for the conventional tin-lead solder in all devices.
在传统的消费电子产品如手机中,含铅互连提供了不同电路元件之间的导电路径。环境问题促使人们寻找无铅替代品。Li等人在他们的“观点”文章中回顾了这些努力,这些努力主要集中在无铅合金和导电粘合剂上。这两种方法都显示出了前景,但没有一种无铅互连材料能在所有设备中替代传统的锡铅焊料。